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Advantages：

1. Replace manual packaging and reduce labor costs.
2. High production capacity, one packaging machine can connect to multiple sorting machines simultaneously.
3. High precision AOI detection with higher accuracy and efficiency than manual inspection.
4. The packaging material input adopts a dual compartment design, which can achieve non-stop material replacement.
5. The modular design can quickly change types.
6. Various defect detection, including chipping, missing corners, dirt, and color difference on the upper surface of the four sides and corners, and has the function of multiple pieces.

Parameters：

1. Capacity: 15s/pack.
2. Fragment rate: ≤0.005%.
3. Equipment utilization rate: ≥99%.
4. Camera count accuracy: ≥99.8%.
5. Silicon wafer edge failure rate: ≤0.2%.
6. Silicon wafer edge collapse inspection rate: ≤2%.
7. Equipment length, width, and height: 6.8m*2.4m*2.3m.
8. Total power: 30KW; Power supply: 220V±10%, frequency 50HZ.
9. Air pressure: 0.5-0.7MPa.
*The above parameters are subject to the actual product.

Applications：

Applicable for silicon wafer dimensions: 166mm-230mm whole wafer.
Applicable silicon wafer thickness: 100μm-160μm.